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Polymer Bonding Materials for Low-cost Chip Packaging. Novel, reworkable, fast-curing, high performance, wafer-level underfill materials are being developed to significantly reduce processing time and cut material costs. The new materials to be developed are novel polymers that do not exhibit the draw backs of conventional materials, such as high viscosity, long cure time, short shelf-life and susceptiblity to moisture.

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• Polymers and Nano Science Chemistry Publications [57]

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