SMARTech   Library Home
 

Georgia Tech's Institutional Repository >
Georgia Tech Conferences >
Recycling of Fibrous Textile and Carpet Waste Conference >
Recycling of Fibrous Textile and Carpet Waste Conference (7th - 2002) >
RFTCW02. Session II >

Please use this identifier to cite or link to this item: http://hdl.handle.net/1853/11092

Title: Nyloboard Building Materials
Authors: Bacon, Forrest
Holland, Wendell
Weitz, Jack
Kelly, Patrick
Nyloboard LLC
Subjects : Building materials
Wood-replacement products
Ceramic-like material made from recycled carpet
Leather-like material from recycled carpet
Issue Date: 13-May-2002
Publisher: Georgia Institute of Technology
Abstract: Three new categories of building materials are discussed, all made from needle-punched mats obtained from shredded carpet: (1) "Nyloprime" is made with a two-component adhesive mixture that undergoes foaming reaction to drive the liquid through the dense fiber mat; this material can create a wood-like material in sheets, comparable to plywood or oriented strand board; (2) "Nyloflex" uses heat to soften low-melt polymers such as polypropylene, into a leather-like material; and (3) "Nyloplate" uses resins or heated compression of Nyloboard, to create a harder material that approaches a ceramic in its traits. All three forms offer several major advantages over wood products (including waterproof, bug-proof, and high strength), and can be made by placing a single additional machine at the end of a needle-punch line.
Type: Presentation
URI: http://hdl.handle.net/1853/11092
Appears in Collections:2002 Recycling of Fibrous Textile and Carpet Waste Conference
RFTCW02. Session II

Files in This Item:

File Description SizeFormat
bacon.htmlGT ID and password required.
Other patrons contact Information Delivery:
404-894-4511 or delivery@library.gatech.edu
for procedures to purchase this document
196 BHTMLView/Open

Items in SMARTech are protected by copyright, with all rights reserved, unless otherwise indicated.

 

Valid XHTML 1.0! DSpace Software Copyright © 2002-2007 MIT and Hewlett-Packard - Feedback