| Title: | Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions |
| Author: | Zhang, Rongwei ; Li, Yi ; Yim, Myung Jin ; Moon, Kyoung-Sik ; Lu, Daoqiang ; Wong, C. P. |
| Abstract: | We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer- sized ( 500 nm in diameter) silver (Ag) particle as conductive filler with the effect of -conjugated self-assembled molecular wires. The ACAs with submicrometer-sized Ag particles have higher current carrying capability ( 3400 mA) than those with micro-sized Au-coated polymer particles ( 2000 mA) and Ag nanoparticles ( 2500 mA). More importantly, by construction of -conjugated self-assembled molecular wire junctions between conductive particles and integrated circuit (IC)/substrate, the electrical conductivity has increased by one order of magnitude and the current carrying capability of ACAs has improved by 600 mA. The crucial factors that govern the improved electrical properties are discussed based on the study of alignments and thermal stability of molecules on the submicrometer-sized Ag particle surface with surface-enhanced Raman spectroscopy (SERS), providing a fundamental understanding of conduction mechanism in ACA joints and guidelines for the formulation of high-performance ACAs in electronic packaging industry. |
| Description: |
© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. DOI: 10.1109/TCAPT.2009.2012720 |
| Type: | Article |
| URI: | http://hdl.handle.net/1853/30602 |
| ISSN: | 1521-3331 |
| Citation: | Wong, C.P.; Rongwei Zhang; Kyoung Sik Moon; Lu, D.D.; Yi Li; Myung Jin Yim, "Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions," IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 3, September 2009, 677-683 |
| Date: | 2009-09 |
| Contributor: | Georgia Institute of Technology. School of Materials Science and Engineering |
| Publisher: |
Georgia Institute of Technology
Institute of Electrical and Electronics Engineers, Inc., New York |
| Subject: |
Adhesives
Electrical conductivity Nanoparticles Self-assembly Silver Surface enhanced Raman scattering |
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