Performance and Temperature Aware Floorplanning Optimization for 2D and 3D Microarchitectures
Healy, Michael Benjamin
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The main objective of this thesis is to develop a physical design tool that is capable of being used by microarchitects to evaluate the impact of their design decisions on the physical design aspects of future microprocessor development. For deep submicron technology wire delay will scale increasingly badly compared to gate delay and so will become a major bottleneck to performance improvement. Three dimensional integrated circuits (3D ICs) offer a new method of dealing with non-linear wire latency by allowing shorter interconnects that act within their linear region. Thermal considerations in 3D ICs will be more important than traditional designs however, so this problem must also be addressed. This thesis presents a microarchitectural floorplanning tool that will help computer architects to attack the wire delay problem early in the design stages of higher performance microprocessors by including consideration of design for 3D ICs. Consideration of the new problems that occur due to the move to 3D and inherent difficulties with deep submicron design is included. Experiments demonstrate that this tool can generate microprocessor floorplans that include many objectives and continue to enhance performance into the next generation of high performance design.