Channel and Pin Assignment for Three Dimensional Packaging Routing

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dc.contributor.author Minz, Jacob Rajkumar
dc.contributor.author Lim, Sung Kyu
dc.date.accessioned 2004-08-11T19:31:01Z
dc.date.available 2004-08-11T19:31:01Z
dc.date.issued 2004-05-24
dc.identifier.uri http://hdl.handle.net/1853/106
dc.description.abstract Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. The contribution of this work is threefold: (i) formulation of the new 3-dimensional global routing problem, (ii) a new routing flow that considers the various design constraints unique to SOP, and (iii) a global router for the technology. Our related experimental results demonstrate the effectiveness of our algorithm. en
dc.format.extent 218888 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.publisher Georgia Institute of Technology
dc.relation.ispartofseries CERCS;GIT-CERCS-04-21
dc.subject 3D packaging
dc.subject Three dimensional global routing
dc.subject Algorithms
dc.subject Channel and pin assignments
dc.subject Floorplanning
dc.subject SOP
dc.subject System-on-Package (SOP)
dc.title Channel and Pin Assignment for Three Dimensional Packaging Routing en
dc.type Technical Report


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