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dc.contributor.authorMinz, Jacob Rajkumar
dc.contributor.authorLim, Sung Kyu
dc.date.accessioned2004-08-11T19:31:01Z
dc.date.available2004-08-11T19:31:01Z
dc.date.issued2004-05-24
dc.identifier.urihttp://hdl.handle.net/1853/106
dc.description.abstractThree dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. The contribution of this work is threefold: (i) formulation of the new 3-dimensional global routing problem, (ii) a new routing flow that considers the various design constraints unique to SOP, and (iii) a global router for the technology. Our related experimental results demonstrate the effectiveness of our algorithm.en
dc.format.extent218888 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherGeorgia Institute of Technology
dc.relation.ispartofseriesCERCS;GIT-CERCS-04-21
dc.subject3D packaging
dc.subjectThree dimensional global routing
dc.subjectAlgorithms
dc.subjectChannel and pin assignments
dc.subjectFloorplanning
dc.subjectSOP
dc.subjectSystem-on-Package (SOP)
dc.titleChannel and Pin Assignment for Three Dimensional Packaging Routingen
dc.typeTechnical Report


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