Now showing items 50-61 of 61

    • Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction 

      Wong, C. P.; Urasaki, Naoyuki (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-10)
      Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal ...
    • Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications 

      Wong, C. P.; Sun, Yangyang; Zhang, Zhuqing (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2006-03)
      The nanosilica filled composite is a promising material for the no-flow underfill in flip-chip application. However, as the filler size decreases into the nano length scale, the rheological, mechanical, and thermal mechanical ...
    • A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems 

      Wong, C. P.; Lu, Daoqiang (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2000-09)
      Electrically conductive adhesives (ECAs) are an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. However, current conductive technology is still in its infancy and ...
    • A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives 

      Wong, C. P.; Lu, Daoqiang (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-09)
      Conductive adhesives are composites of polymer matrixes and metal fillers (conductive elements). Silver (Ag) flakes are widely used as fillers for electrically conductive adhesives (ECA’s). Generally, there is a thin ...
    • Study on Effect of Carbon Black on Behavior of Conductive Polymer Composites with Positive Temperature Coefficient 

      Wong, C. P.; Luo, Shijian (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2000-03)
      Conductive polymer composites showing large positive temperature coefficient (PTC) are made of semi-crystalline polymer as an insulator and a conducting filler, whose concentration is close to the critical volume fraction. ...
    • Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging 

      Wong, C. P.; Luo, Shijian (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2001-03)
      Coupling agents are widely used in order to improve the adhesion property of underfill. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agent were added ...
    • Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation 

      Wong, C. P.; Fan, Lianhua; Tison, Christopher K. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-11)
      Underfill materials are employed in flip-chip assemblies to enhance solder joint reliability performance. The adhesion of underfills with solders is important to the integrity of the flip-chip structure. We have studied ...
    • Surface Property of Passivation Layer on Integrated Circuit Chip and Solder Mask Layer on Printed Circuit Board 

      Wong, C. P.; Luo, Shijian (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-10)
      Adhesion of underfill to passivation layer on integrated circuit chip and solder mask layer on printed circuit board is critical to the reliability of an underfilled flip chip package. In this study, the surface properties ...
    • Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management 

      Lin, Wei; Zhang, Rongwei; Moon, Kyoung-Sik; Wong, C. P. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., 2010-05)
      Vertically aligned carbon nanotubes (VACNTs) grown on bulk copper substrate are of great importance for real-life commercial applications of carbon nanotubes (CNTs) as thermal interface materials in microelectronic packaging. ...
    • Thermal and Mechanical Characterization of ViaLux™ 81: A Novel Epoxy Photo-Dielectric Dry Film (PDDF) for Microvia Applications 

      Wong, C. P.; Dunne, Rajiv Carl; Sitaraman, Suresh K.; Luo, Shijian; Estes, William E.; Periyasamy, Mookkan; Coburn, John (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2001-09)
      Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, ...
    • Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates 

      Wong, C. P.; Wu, Jiali; Pike, Randy T. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1998-10)
      Large area substrate processing is a key solution for improving the productivity of multichip module deposition (MCM-D) technology. This project is focused on high temperature polymeric adhesives for attachment of silicon ...
    • Void Formation Study of Flip Chip in Package Using No-Flow Underfill 

      Lee, Sangil; Yim, Myung Jin; Master, Raj N.; Wong, C. P.; Baldwin, Daniel F. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., 2008-10)
      The advanced flip chip in package (FCIP) process using no-flow underfill material for high I/O density and fine-pitch interconnect applications presents challenges for an assembly process that must achieve high electrical ...