• Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants 

      Wong, C. P.; Fan, Lianhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-04)
      The thermosetting epoxy curing systems have been widely used as encapsulants in the electronic packaging industry. With the continual evolving of electronic product markets, material suppliers have been challenged to ...
    • Development of Reworkable Underfill From Hybrid Composite of Free Radical Polymerization System and Epoxy Resin 

      Wong, C. P.; Fan, Lianhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-03)
      The application of the underfill encapsulant is to enhance the solder joint fatigue life in the flip chip assembly, typically up to an order of magnitude, as compared to the nonunderfilled devices. Most of the current ...
    • Effect of UV/Ozone Treatment on Surface Tension and Adhesion in Electronic Packaging 

      Wong, C. P.; Luo, Shijian (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2001-03)
      Surface tension of material surfaces and interfaces is an important parameter that affects wetting and adhesion. Surface tension can be divided into three components: Lifshitz–van der Waals component, acid component, ...
    • Moisture Absorption in Uncured Underfill Materials 

      Wong, C. P.; Luo, Shijian (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2004-06)
      This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing ...
    • Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction 

      Wong, C. P.; Urasaki, Naoyuki (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-10)
      Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal ...
    • Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging 

      Wong, C. P.; Luo, Shijian (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2001-03)
      Coupling agents are widely used in order to improve the adhesion property of underfill. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agent were added ...
    • Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation 

      Wong, C. P.; Fan, Lianhua; Tison, Christopher K. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-11)
      Underfill materials are employed in flip-chip assemblies to enhance solder joint reliability performance. The adhesion of underfills with solders is important to the integrity of the flip-chip structure. We have studied ...
    • Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates 

      Wong, C. P.; Wu, Jiali; Pike, Randy T. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1998-10)
      Large area substrate processing is a key solution for improving the productivity of multichip module deposition (MCM-D) technology. This project is focused on high temperature polymeric adhesives for attachment of silicon ...