• Novel Reworkable Fluxing Underfill for Board-Level Assembly 

      Wong, C. P.; Zhang, Zhuqing; Li, Haiying (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2004-09)
      Underfills are traditionally applied for flip-chip applications. Recently, there has been increasing use of underfill for board-level assembly including ball grid arrays (BGAs) and chip scale packages (CSPs) to enhance ...