• Novel Thermally Reworkable Underfill Encapsulants For Flip-Chip Applications 

      Wong, C. P.; Wang, Lejun (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-02)
      The flip-chip technique of integrated circuit (IC) chip interconnection is the emerging technology for high performance, high input/output (I/O) IC devices. Due to the coefficient of thermal expansion mismatch between the ...