• Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants 

      Wong, C. P.; Fan, Lianhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-04)
      The thermosetting epoxy curing systems have been widely used as encapsulants in the electronic packaging industry. With the continual evolving of electronic product markets, material suppliers have been challenged to ...
    • An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants 

      Wong, C. P.; Rao, Yang; Shi, Songhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2000-09)
      Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages. The validity of the simulation results strongly depends on the inputs of the involved ...