Polymers and Nano Science Chemistry Publications
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Recent Submissions
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Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., 2009-12)This paper is an investigation of the feasibility of applying a mechanically flexible magnetic composite material to radio frequency identification (RFID) planar antennas operating in the lower ultrahigh-frequency (UHF) ... -
Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., 2010-05)Vertically aligned carbon nanotubes (VACNTs) grown on bulk copper substrate are of great importance for real-life commercial applications of carbon nanotubes (CNTs) as thermal interface materials in microelectronic packaging. ... -
High dielectric insulation coating for time domain reflectometry soil moisture sensor
(Georgia Institute of TechnologyAmerican Geophysical Union, 2004-04)Insulation coating is often applied to time domain reflectometry (TDR) soil moisture sensors to reduce the conduction loss of energy. However, because of low dielectric constants of common plastic insulation materials, ... -
Material characterization of high dielectric constant polymer–ceramic composite for embedded capacitor to RF application
(Georgia Institute of TechnologyHindawi Publishing Corporation, 2002)Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor ... -
Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, 2009-04)The advanced flip-chip-in-package (FCIP) process technology, using no-flow underfill material for high I/O density (over 3000 I/O) and fine-pitch (down to 150 μm) interconnect applications, presents challenges for flip ... -
Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2009-02)In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced for next ... -
Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2009-09)We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer- sized ( 500 nm in diameter) silver (Ag) particle as conductive filler with the effect of -conjugated ... -
Monolayer protection for eletrochemical migration control in silver nanocomposite
(Georgia Institute of TechnologyAmerican Institute of Physics, 2006-09-12)The authors introduced an effective approach of using monolayer-protected silver nanoparticles to reduce silver migration for electronic device interconnect applications. Formation of surface complex between the carboxylate ... -
Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules
(Georgia Institute of TechnologyAmerican Institute of Physics, 2007-02-26)Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts ... -
Double-Layer No-Flow Underfill Process for Flip-Chip Applications
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-03)No-flow underfill technology shows potential advances over the conventional underfill technology toward a low-cost flop-chip underfill process. However, due to the filler entrapment in between solder bumps and contact pads ... -
Void Formation Study of Flip Chip in Package Using No-Flow Underfill
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., 2008-10)The advanced flip chip in package (FCIP) process using no-flow underfill material for high I/O density and fine-pitch interconnect applications presents challenges for an assembly process that must achieve high electrical ... -
Recent Advances in High-k Nanocomposite Materials for Embedded Capacitor Applications
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2008-10)In this paper, a wide variety of high dielectric constant (k) composite materials which have been developed and evaluated for embedded capacitor application are reviewed. Current research efforts toward achieving high ... -
Conformal Magnetic Composite RFID for Wearable RF and Bio-Monitoring Applications
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2008-12-12)This paper introduces for the first time a novel flexible magnetic composite material for RF identification (RFID) and wearable RF antennas. First, one conformal RFID tag working at 480 MHz is designed and fabricated as a ... -
A Novel Nanocomposite with Photo-Polymerization for Wafer Level Application
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2008-03)A novel nanocomposite photo-curable material which can act both as a photoresist and a stress redistribution layer applied on the wafer level was synthesized and studied. In the experiments, 20-nm silica fillers were ... -
Electrical Property Improvement of Electrically Conductive Adhesives Through In-Situ Replacement by Short-Chain Difunctional Acids
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2006-03)To improve the electrical properties of electrically conductive adhesives (ECAs), short-chain difunctional acids, such as malonic acid (acid M), adipic acid (acid A), and terephthalic acid (acid T) were introduced into a ... -
Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2006-03)The nanosilica filled composite is a promising material for the no-flow underfill in flip-chip application. However, as the filler size decreases into the nano length scale, the rheological, mechanical, and thermal mechanical ... -
A Novel Aluminum-Filled Composite Dielectric for Embedded Passive Applications
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2006-05)This paper presents the development of a novel aluminum- filled high dielectric constant composite for embedded passive applications. Aluminum is well known as a low-cost and fast self-passivation metal. The self-passivation ... -
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s)
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-07)Isotropic conductive adhesives (ICA’s) are usually composites of adhesive resins with conductive fillers (mainly silver flakes). The adhesive pastes before cure usually have low electrical conductivity. The conductive ... -
Study on Effect of Carbon Black on Behavior of Conductive Polymer Composites with Positive Temperature Coefficient
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2000-03)Conductive polymer composites showing large positive temperature coefficient (PTC) are made of semi-crystalline polymer as an insulator and a conducting filler, whose concentration is close to the critical volume fraction. ... -
Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2001-03)Coupling agents are widely used in order to improve the adhesion property of underfill. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agent were added ...
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