• Development of High Performance Interfill Materials for System Chips Technology 

      Wong, C. P.; Wu, Jiali; Bhattacharya, Swapan; Lloyd, Courtney; Pogge, H. Bernhard; Tummala, Rao R. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-06)
      An innovative precisely interconnected chip (PIC) technology is currently under development at IBM to seek more effective means of creating system chips. The objective of this research is developing fabrication methods to ...