• Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants 

      Wong, C. P.; Fan, Lianhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-04)
      The thermosetting epoxy curing systems have been widely used as encapsulants in the electronic packaging industry. With the continual evolving of electronic product markets, material suppliers have been challenged to ...
    • Development of Environmental Friendly Non-Anhydride No-Flow Underfills 

      Wong, C. P.; Zhang, Zhuqing; Fan, Lianhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-03)
      Most no-flow underfill materials are based on poxy/anhydride chemistry. Due to the sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using nonanhydride curing system. This ...
    • Development of Reworkable Underfill From Hybrid Composite of Free Radical Polymerization System and Epoxy Resin 

      Wong, C. P.; Fan, Lianhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-03)
      The application of the underfill encapsulant is to enhance the solder joint fatigue life in the flip chip assembly, typically up to an order of magnitude, as compared to the nonunderfilled devices. Most of the current ...
    • Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation 

      Wong, C. P.; Fan, Lianhua; Tison, Christopher K. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-11)
      Underfill materials are employed in flip-chip assemblies to enhance solder joint reliability performance. The adhesion of underfills with solders is important to the integrity of the flip-chip structure. We have studied ...