Now showing items 25-44 of 61

    • High dielectric insulation coating for time domain reflectometry soil moisture sensor 

      Fujiyasu, Y.; Pierce, C. E.; Fan, L.; Wong, C. P. (Georgia Institute of TechnologyAmerican Geophysical Union, 2004-04)
      Insulation coating is often applied to time domain reflectometry (TDR) soil moisture sensors to reduce the conduction loss of energy. However, because of low dielectric constants of common plastic insulation materials, ...
    • High Performance No-Flow Underfills for Low-Cost Flip-Chip Applications: Material Characterization 

      Wong, C. P.; Shi, Songhua; Jefferson, G. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1998-09)
      Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill encapsulant is an attractive flip-chip encapsulant due to the simplification of the no-flow ...
    • An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants 

      Wong, C. P.; Rao, Yang; Shi, Songhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2000-09)
      Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages. The validity of the simulation results strongly depends on the inputs of the involved ...
    • Improved Stability of Contact Resistance of Low Melting Point Alloy Incorporated Isotropically Conductive Adhesives 

      Wong, C. P.; Moon, Kyoung-Sik; Wu, Jiali (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-06)
      With the driving force of “green” revolution in the electronics industry, tremendous efforts have been made in pursuing lead-free alternatives. Although lately lead-free alloys have drawn a lot of attention, their ...
    • An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages 

      Wong, C. P.; Li, Haiying; Jacob, Karl I. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-02)
      Effective heat dissipation is crucial to enhance the performance and reliability of electronic devices. In this work, the performance of encapsulants filled with carbon fiber was studied and compared with silica filled ...
    • Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules 

      Dong, Hai; Li, Yi; Yim, Myung Jin; Moon, Kyoung-Sik; Wong, C. P. (Georgia Institute of TechnologyAmerican Institute of Physics, 2007-02-26)
      Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts ...
    • Material characterization of high dielectric constant polymer–ceramic composite for embedded capacitor to RF application 

      Rao, Yang; Yue, Jireh; Wong, C. P. (Georgia Institute of TechnologyHindawi Publishing Corporation, 2002)
      Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor ...
    • Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives 

      Wong, C. P.; Lu, Daoqiang; Tong, Quinn K. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-07)
      One critical obstacle of current conductive adhesives is their unstable contact resistance with nonnoble metal finished components during high temperature and humidity aging. It is commonly accepted that metal oxide ...
    • Modeling of the Curing Kinetics of No-Flow Underfill in Flip-Chip Applications 

      Wong, C. P.; Zhang, Zhuqing (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2004-06)
      No-flow underfill has greatly improved the production efficiency of flip-chip process. Due to its unique characteristics, including reaction latency, curing under solder reflow conditions and the desire for no post-cure, ...
    • Moisture Absorption in Uncured Underfill Materials 

      Wong, C. P.; Luo, Shijian (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2004-06)
      This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing ...
    • Monolayer protection for eletrochemical migration control in silver nanocomposite 

      Li, Yi; Wong, C. P. (Georgia Institute of TechnologyAmerican Institute of Physics, 2006-09-12)
      The authors introduced an effective approach of using monolayer-protected silver nanoparticles to reduce silver migration for electronic device interconnect applications. Formation of surface complex between the carboxylate ...
    • Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill 

      Lee, Sangil; Yim, Myung Jin; Master, Raj N.; Wong, C. P.; Baldwin, Daniel F. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, 2009-04)
      The advanced flip-chip-in-package (FCIP) process technology, using no-flow underfill material for high I/O density (over 3000 I/O) and fine-pitch (down to 150 μm) interconnect applications, presents challenges for flip ...
    • Next Generation of 100-μm-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package 

      Wong, C. P.; Kang, E. T.; Tay, Andrew A. O.; Wong, E. H.; Swaminathan, Madhavan; Iyer, Mahadevan K.; Rotaru, Mihai D.; Tummala, Rao R.; Doraiswami, Ravi; Ang, Simon S.; Kripesh, V. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2004-05)
      According to the latest ITRS roadmap, the pitch of area array packages is expected to decrease to 100 μm by 2009. Simultaneously, the electrical performance of these interconnections needs to be improved to support data ...
    • Nonhermetic Plastic Packaging of High Voltage Electronic Switches Utilizing a Low-Stress Glob Coating for 95/5Pb/Sn Solder Joints of Flip-Chip Bonded Multichip Module High Voltage Devices 

      Wong, C. P.; Segelken, John M.; Tai, K. L.; Wong, C. C. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1998-01)
      AT&T’s number five electronic switching system (ESS) is a state-of-the-art electronic switch that uses solid-state gated-diode-crosspoint (GDX) for fast switching of telephone calls. These GDX’s operate at 375 V and require ...
    • A Novel Aluminum-Filled Composite Dielectric for Embedded Passive Applications 

      Wong, C. P.; Xu, Jianwen; Moon, Kyoung-Sik; Tison, Christopher K. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2006-05)
      This paper presents the development of a novel aluminum- filled high dielectric constant composite for embedded passive applications. Aluminum is well known as a low-cost and fast self-passivation metal. The self-passivation ...
    • Novel Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS Encapsulation 

      Wong, C. P.; Wu, Jiali; Pike, Randy T. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-07)
      A flexible, smooth, and low profile conformal coating was developed to accomplish the encapsulation of a microelectromechanical system (MEMS) device that will be applied to sense the static pressure on aircraft during ...
    • Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect 

      Li, Yi; Yim, Myung Jin; Moon, Kyoung-Sik; Wong, C. P. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2009-02)
      In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced for next ...
    • A Novel Nanocomposite with Photo-Polymerization for Wafer Level Application 

      Sun, Yangyang; Jiang, Hongjin; Zhu, Lingbo; Wong, C. P. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2008-03)
      A novel nanocomposite photo-curable material which can act both as a photoresist and a stress redistribution layer applied on the wafer level was synthesized and studied. In the experiments, 20-nm silica fillers were ...
    • Novel Reworkable Fluxing Underfill for Board-Level Assembly 

      Wong, C. P.; Zhang, Zhuqing; Li, Haiying (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2004-09)
      Underfills are traditionally applied for flip-chip applications. Recently, there has been increasing use of underfill for board-level assembly including ball grid arrays (BGAs) and chip scale packages (CSPs) to enhance ...
    • Novel Thermally Reworkable Underfill Encapsulants For Flip-Chip Applications 

      Wong, C. P.; Wang, Lejun (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-02)
      The flip-chip technique of integrated circuit (IC) chip interconnection is the emerging technology for high performance, high input/output (I/O) IC devices. Due to the coefficient of thermal expansion mismatch between the ...