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    Monolayer protection for eletrochemical migration control in silver nanocomposite 

    Li, Yi; Wong, C. P. (Georgia Institute of Technology, 2006-09-12)
    The authors introduced an effective approach of using monolayer-protected silver nanoparticles to reduce silver migration for electronic device interconnect applications. Formation of surface complex between the carboxylate ...
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    Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules 

    Dong, Hai; Li, Yi; Yim, Myung Jin; Moon, Kyoung-Sik; Wong, C. P. (Georgia Institute of Technology, 2007-02-26)
    Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts ...
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    Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions 

    Zhang, Rongwei; Li, Yi; Yim, Myung Jin; Moon, Kyoung-Sik; Lu, Daoqiang; Wong, C. P. (Georgia Institute of Technology, 2009-09)
    We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer- sized ( 500 nm in diameter) silver (Ag) particle as conductive filler with the effect of -conjugated ...
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    Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect 

    Li, Yi; Yim, Myung Jin; Moon, Kyoung-Sik; Wong, C. P. (Georgia Institute of Technology, 2009-02)
    In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced for next ...
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    Electrical Property Improvement of Electrically Conductive Adhesives Through In-Situ Replacement by Short-Chain Difunctional Acids 

    Wong, C. P.; Li, Yi; Moon, Kyoung-Sik (Georgia Institute of Technology, 2006-03)
    To improve the electrical properties of electrically conductive adhesives (ECAs), short-chain difunctional acids, such as malonic acid (acid M), adipic acid (acid A), and terephthalic acid (acid T) were introduced into a ...

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    Li, Yi (5)
    Wong, C. P. (5)Moon, Kyoung-Sik (4)Yim, Myung Jin (3)Dong, Hai (1)Lu, Daoqiang (1)Zhang, Rongwei (1)SubjectIntegrated circuit interconnections (3)Adhesives (2)Electrical conductivity (2)Nanoparticles (2)Silver (2)Bonding processes (1)Conductivity improvement (1)Contact resistance (1)Dicarboxylic acid (1)Electrical contacts (1)... View MoreDate Issued2006 (2)2009 (2)2007 (1)Has File(s)Yes (5)
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