Adhesion of underfill to passivation layer on integrated circuit chip and solder mask layer on printed circuit board is critical to the reliability of an underfilled flip chip package. In this study, the surface properties ...

Conductive polymer composites showing large positive temperature coefficient (PTC) are made of semi-crystalline polymer as an insulator and a conducting filler, whose concentration is close to the critical volume fraction. ...

Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, ...

Surface tension of material surfaces and interfaces is an important parameter that affects wetting and adhesion. Surface tension can be divided into three components: Lifshitz–van der Waals component, acid component, ...

Coupling agents are widely used in order to improve the adhesion property of underfill. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agent were added ...

This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing ...