The no-flow underfill has been invented and practiced in the industry for a few years. However, due to the interfering of silica fillers with solder joint formation, most no-flow underfills are not filled with silica ...

No-flow underfill has greatly improved the production efficiency of flip-chip process. Due to its unique characteristics, including reaction latency, curing under solder reflow conditions and the desire for no post-cure, ...

Most no-flow underfill materials are based on poxy/anhydride chemistry. Due to the sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using nonanhydride curing system. This ...

No-flow underfill technology shows potential advances over the conventional underfill technology toward a low-cost flop-chip underfill process. However, due to the filler entrapment in between solder bumps and contact pads ...

Underfills are traditionally applied for flip-chip applications. Recently, there has been increasing use of underfill for board-level assembly including ball grid arrays (BGAs) and chip scale packages (CSPs) to enhance ...

Flip chip on organic substrate has relied on underfill to redistribute the thermomechanical stress and to enhance the solder joint reliability. However, the conventional flip-chip underfill process involves multiple ...

The nanosilica filled composite is a promising material for the no-flow underfill in flip-chip application. However, as the filler size decreases into the nano length scale, the rheological, mechanical, and thermal mechanical ...

Lead-free solder reflow process has presented challenges to no-flow underfill material and assembly. The currently available no-flow underfill materials are mainly designed for eutectic Sn–Pb solders. This paper presents ...

No-flow underfill process in flip-chip assembly has become a promising technology toward a smaller, faster and more cost-efficient packaging technology. The current available no-flow underfill materials are mainly ...

In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the thermomechanical stress created by the coefficient of thermal expansion (CTE) mismatch between ...