Now showing items 1-5 of 5
Development of New No-Flow Underfill Materials for Both Eutectic Sn-Pb Solder and a High Temperature Melting Lead-Free Solder
(Georgia Institute of Technology, 2003-06)
In recent years, no-flow underfill technology has drawn more attention due to its potential cost-savings advantages over conventional underfill technology, and as a result several no-flow underfill materials have been ...
Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging
(Georgia Institute of Technology, 2001-03)
Coupling agents are widely used in order to improve the adhesion property of underfill. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agent were added ...
A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
(Georgia Institute of Technology, 2000-09)
Electrically conductive adhesives (ECAs) are an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. However, current conductive technology is still in its infancy and ...
Chemical and Mechanical Adhesion Mechanisms of Sputter-Deposited Metal on Epoxy Dielectric for High Density Interconnect Printed Circuit Boards
(Georgia Institute of Technology, 2001-09)
Strong chemical reactions between metal and polymer substrates significantly enhance adhesion of the metal to the polymer. This study investigated the adhesion of three types of thin film metals, including Cu, NiCr, and ...
Moisture Absorption in Uncured Underfill Materials
(Georgia Institute of Technology, 2004-06)
This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing ...