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dc.contributor.authorWong, C. P.
dc.contributor.authorLi, Haiying
dc.contributor.authorJacob, Karl I.
dc.date.accessioned2006-08-02T19:38:01Z
dc.date.available2006-08-02T19:38:01Z
dc.date.issued2003-02
dc.identifier.citationIEEE Transactions on Advanced Packaging, Vol. 26, No. 1, February 2003, 25-32en
dc.identifier.urihttp://hdl.handle.net/1853/11099
dc.description©2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en
dc.description.abstractEffective heat dissipation is crucial to enhance the performance and reliability of electronic devices. In this work, the performance of encapsulants filled with carbon fiber was studied and compared with silica filled encapsulants. Encapsulants filled with mixed combination of fillers for optimizing key properties were also investigated. The thermal and electrical conductivities were investigated and glass transition temperature (Tg), thermal expansion coefficient (TCE), and storage modulus ( ) of these materials were studied with thermal analysis methods. The composites filled with both carbon fiber and silica showed an increase of thermal conductivity three to five times of that of silica filled encapsulants of the same filler loading while maintaining/enhancing major mechanical and thermal properties.en
dc.format.extent1128595 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen
dc.publisherGeorgia Institute of Technologyen
dc.subjectCarbon fiber
dc.subjectEncapsulants
dc.subjectFlip-chip packages
dc.subjectGlass transition temperature
dc.subjectSilica
dc.subjectTCE
dc.subjectUnderfill materials
dc.titleAn Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packagesen
dc.typeArticleen
dc.publisher.originalInstitute of Electrical and Electronics Engineers, Inc., New York


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