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    Development of New Low Stress Epoxies for MEMS Device Encapsulation

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    CPWongIEEE24.pdf (226.2Kb)
    Date
    2002-06
    Author
    Wong, C. P.
    Wu, Jiali
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    Abstract
    In this study, a series of new low stress epoxies was introduced as conformal encapsulants, which show a high promise to meet all the requirements for the protection of the pressure sensor system. Mechanical properties such as initial Young’s modulus, toughness and ultimate tensile stress were evaluated. The more critical issue of material’s contamination resistance to the jet fuel was improved. And the mechanism behind materials lowstress and toughness behaviors was investigated from the viewpoint of microstructure.
    URI
    http://hdl.handle.net/1853/11429
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    • Polymers and Nano Science Chemistry Publications [61]

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