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dc.contributor.authorWong, C. P.
dc.contributor.authorWu, Jiali
dc.date.accessioned2006-08-21T16:38:49Z
dc.date.available2006-08-21T16:38:49Z
dc.date.issued2002-06
dc.identifier.citationIEEE Transactions on Components and Packaging Technologies, Vol. 25, no. 2, June 2002, 278-282en
dc.identifier.urihttp://hdl.handle.net/1853/11429
dc.description©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en
dc.description.abstractIn this study, a series of new low stress epoxies was introduced as conformal encapsulants, which show a high promise to meet all the requirements for the protection of the pressure sensor system. Mechanical properties such as initial Young’s modulus, toughness and ultimate tensile stress were evaluated. The more critical issue of material’s contamination resistance to the jet fuel was improved. And the mechanism behind materials lowstress and toughness behaviors was investigated from the viewpoint of microstructure.en
dc.format.extent231705 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen
dc.publisherGeorgia Institute of Technologyen
dc.subjectContamination resistanceen
dc.subjectLow stress epoxiesen
dc.subjectMicroelectromechanical systems (MEMS)en
dc.subjectToughnessen
dc.titleDevelopment of New Low Stress Epoxies for MEMS Device Encapsulationen
dc.typeArticleen
dc.publisher.originalInstitute of Electrical and Electronics Engineers, Inc., New York


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