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dc.contributor.authorWong, C. P.
dc.contributor.authorZhang, Zhuqing
dc.contributor.authorLi, Haiying
dc.date.accessioned2006-08-28T15:40:09Z
dc.date.available2006-08-28T15:40:09Z
dc.date.issued2004-09
dc.identifier.citationIEEE Transactions on Advanced Packaging, Vol. 27, no. 3, August 2004, 525-532en
dc.identifier.urihttp://hdl.handle.net/1853/11435
dc.description©2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en
dc.description.abstractUnderfills are traditionally applied for flip-chip applications. Recently, there has been increasing use of underfill for board-level assembly including ball grid arrays (BGAs) and chip scale packages (CSPs) to enhance reliability in harsh environments and impact resistance to mechanical shocks. The no-flow underfill process eliminates the need for capillary flow and combines fluxing and underfilling into one process step, which simplifies the assembly of underfilled BGAs and CSPs for SMT applications. However, the lack of reworkability decreases the final yield of assembled systems. In this paper, no-flow underfill formulations are developed to provide fluxing capability, reworkability, high impact resistance, and good reliability for the board-level components. The designed underfill materials are characterized with the differential scanning calorimeter (DSC), the thermal mechanical analyzer (TMA), and the dynamic mechanical analyzer (DMA). The potential reworkability of the underfills is evaluated using the die shear test at elevated temperatures. The 3-point bending test and the DMA frequency sweep indicate that the developed materials have high fracture toughness and good damping properties. CSP components are assembled on the board using developed underfill. High interconnect yield is achieved. Reworkability of the underfills is demonstrated. The reliability of the components is evaluated in air-to-air thermal shock (AATS). The developed formulations have potentially high reliability for board-level components.en
dc.format.extent1240038 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen
dc.publisherGeorgia Institute of Technologyen
dc.subjectAssemblyen
dc.subjectMaterial propertiesen
dc.subjectReworkableen
dc.subjectReliabilityen
dc.subjectUnderfillen
dc.titleNovel Reworkable Fluxing Underfill for Board-Level Assemblyen
dc.typeArticleen
dc.publisher.originalInstitute of Electrical and Electronics Engineers, Inc., New York


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