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dc.contributor.authorWong, C. P.
dc.contributor.authorZhang, Zhuqing
dc.date.accessioned2006-08-28T16:29:42Z
dc.date.available2006-08-28T16:29:42Z
dc.date.issued2004-08
dc.identifier.citationIEEE Transactions on Advanced Packaging, Vol. 27, no. 3, August 2004, 515-524en
dc.identifier.urihttp://hdl.handle.net/1853/11437
dc.description©2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en
dc.description.abstractIn order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the thermomechanical stress created by the coefficient of thermal expansion (CTE) mismatch between the silicon chip and organic substrate. However, the conventional underfill relies on the capillary flow of the underfill resin and has many disadvantages. In order to overcome these disadvantages, many variations have been invented to improve the flip-chip underfill process. This paper reviews the recent advances in the material design, process development, and reliability issues of flip-chip underfill, especially in no-flow underfill, molded underfill, and wafer-level underfill. The relationship between the materials, process, and reliability in these packages is discussed.en
dc.format.extent830600 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen
dc.publisherGeorgia Institute of Technologyen
dc.subjectFlip-chip devicesen
dc.subjectInterconnecten
dc.subjectMaterialsen
dc.subjectReliabilityen
dc.subjectUnderfillen
dc.titleRecent Advances in Flip-Chip Underfill: Materials, Process, and Reliabilityen
dc.typeArticleen
dc.publisher.originalInstitute of Electrical and Electronics Engineers, Inc., New York


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