Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction

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Title: Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction
Author: Wong, C. P. ; Urasaki, Naoyuki
Abstract: Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only used as protective materials for integrated circuit (IC) devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which will improve adhesion strength and eliminate low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FT-IR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of silicone resin. Gas chromatography-mass spectrometry (GC/MS) was used to identify the low molecular weight cyclic siloxanes. Thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA), and die shear test were used for evaluate the properties of silicone resin.
Description: ©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Type: Article
Citation: IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, no. 4, October 1999, 295-298
Date: 1999-10
Publisher: Georgia Institute of Technology
Institute of Electrical and Electronics Engineers, Inc., New York
Subject: Adhesion
Gas chromatography-mass spectrometry (GC/MS)
Low-molecular weight creep

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