Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates

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Title: Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates
Author: Wong, C. P. ; Wu, Jiali ; Pike, Randy T.
Abstract: Large area substrate processing is a key solution for improving the productivity of multichip module deposition (MCM-D) technology. This project is focused on high temperature polymeric adhesives for attachment of silicon tiles to suitable pallets to facilitate large area film processing of MCM structures. Current polymeric high temperature adhesives are predominately polyimide-based that are not reworkable, which places an obstacle to remove the coated substrates and to reuse the high cost pallets. However, an approach will be presented in this paper to address this demand by introducing thermally cleavable links in the thermoset polyimide-amide resin. A series of novel reworkable high temperature (in excess of 350–400 ℃) adhesives have been developed, that can meet the requirements of adhesion, viscosity, thermal stability, and reworkability of the MCM-D production. Furthermore, scanning electron microscopy (SEM) microstructure images are presented for intuitive reworkability analysis.
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Type: Article
URI: http://hdl.handle.net/1853/11443
Citation: IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing, Vol. 21, no. 4, October 1998, 311-316
Date: 1998-10
Publisher: Georgia Institute of Technology
Institute of Electrical and Electronics Engineers, Inc., New York
Subject: Adhesion
Multichip module deposition (MCMD)
Polyimide-amide-epoxy
Reworkability
Thermal stability
Thermally cleavable links

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