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dc.contributor.authorSutono, Alberten_US
dc.date.accessioned2007-02-09T20:57:12Z
dc.date.available2007-02-09T20:57:12Z
dc.date.issued1999-05en_US
dc.identifier.urihttp://hdl.handle.net/1853/13375
dc.format.extent237 bytes
dc.format.mimetypetext/html
dc.language.isoen_US
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshWire bonding (Electronic packaging)en_US
dc.subject.lcshMicrowave circuitsen_US
dc.titleWideband characterization of wire bond interconnects for microwave integrated circuit packagingen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentElectrical and Computer Engineeringen_US
dc.description.advisorJoy Laskar
dc.identifier.bibid496355en_US


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