Computational characterization of adhesive bond properties using guided waves in bonded plates
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This research focuses on the application of guided waves techniques to nondestructively characterize the structural integrity of bonded engineering components. Computational methods are used to examine the properties of multi-layered, adhesive bonded plates. This study quantifies the effect of the adhesive bond parameters (Young's modulus, Poisson's ration and bond thickness) on the dispersion curves. A commercial finite element (FE) code (ABAQUS/Explicit) is used for the numerical model while the global matrix method and the waveguide FE method are used to benchmark the resulting dispersion relationships in the form of a frequency-wavenumber or slowness-frequency relation. The postprocessing of FE data includes the two-dimensional Fourier transform (2D-FFT) and the short-time Fourier transform (STFT). Note that the 2D-FFT and STFT operate on multiple or just one transient output signals of the FE results respectively, while the waveguide FE method uses mass-, damping- and stiffness-matrices to generate the dispersion relations. In the dispersion relations, a set of bond parameter sensitive and FE-visible points is selected. The frequency locations of these points represent the solution criteria for the inversion procedure based on the global matrix method. The capabilities of the inversion process depend on the number of transient output signals from an FE simulation for the forward problem.