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dc.contributor.authorChoi, Kwang Limen_US
dc.date.accessioned2007-06-22T13:07:29Z
dc.date.available2007-06-22T13:07:29Z
dc.date.issued1999-08en_US
dc.identifier.urihttp://hdl.handle.net/1853/14858
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshMicroelectronic packaging Mathematical modelsen_US
dc.subject.lcshIntegrated circuits Mathmatical modelsen_US
dc.subject.lcshMicroelectronic packaging Materialsen_US
dc.titleModeling and simulation of embedded passives using rational functions in multi-layered substratesen_US
dc.typeDissertationen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentElectrical and computer engineeringen_US
dc.description.advisorMadhavan Swaminathanen_US
dc.identifier.bibid503467en_US


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