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dc.contributor.authorCafaro, Nicholas Giovanni, Jr.en_US
dc.date.accessioned2007-07-06T11:30:53Z
dc.date.available2007-07-06T11:30:53Z
dc.date.issued2000-05en_US
dc.identifier.urihttp://hdl.handle.net/1853/15454
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshWire bonding (Electronic packaging)en_US
dc.subject.lcshMicrowave circuitsen_US
dc.titleMultiwire microstrip interconnects for high-frequency integrated circuit packagingen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentElectrical and computer engineeringen_US
dc.contributor.departmentElectric engineeringen_US
dc.description.advisorJoy Laskaren_US
dc.identifier.bibid504648en_US


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