| dc.contributor.author | Cafaro, Nicholas Giovanni, Jr. | en_US |
| dc.date.accessioned | 2007-07-06T11:30:53Z | |
| dc.date.available | 2007-07-06T11:30:53Z | |
| dc.date.issued | 2000-05 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/15454 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
| dc.subject.lcsh | Wire bonding (Electronic packaging) | en_US |
| dc.subject.lcsh | Microwave circuits | en_US |
| dc.title | Multiwire microstrip interconnects for high-frequency integrated circuit packaging | en_US |
| dc.type | Thesis | en_US |
| dc.description.degree | M.S. | en_US |
| dc.contributor.department | Electrical and computer engineering | en_US |
| dc.contributor.department | Electric engineering | en_US |
| dc.description.advisor | Joy Laskar | en_US |
| dc.identifier.bibid | 504648 | en_US |
