System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques

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liu_sheng_200105_phd_608215.pdf (15.86Mb)

Date

2001-05

Author

Liu, Sheng

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URI

http://hdl.handle.net/1853/15833

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• Georgia Tech Theses and Dissertations [23403]
• School of Mechanical Engineering Theses and Dissertations [4008]