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dc.contributor.authorLiu, Shengen_US
dc.date.accessioned2007-07-27T11:32:51Z
dc.date.available2007-07-27T11:32:51Z
dc.date.issued2001-05en_US
dc.identifier.urihttp://hdl.handle.net/1853/15833
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshElectronic packagingen_US
dc.subject.lcshSolder and solderingen_US
dc.subject.lcshLasers in engineeringen_US
dc.titleSystem implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniquesen_US
dc.typeDissertationen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorCharles Umeen_US
dc.identifier.bibid608215en_US


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