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dc.contributor.authorMartin, Timothy Leeen_US
dc.date.accessioned2007-07-27T11:33:50Z
dc.date.available2007-07-27T11:33:50Z
dc.date.issued1992-05en_US
dc.identifier.urihttp://hdl.handle.net/1853/15872
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshSolder and solderingen_US
dc.subject.lcshPrinted circuitsen_US
dc.subject.lcshFinite element methoden_US
dc.titleFinite element analysis of printed wiring board deformations during thermal cycles involved in the solder masking processen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorCharles I. Umeen_US
dc.identifier.bibid356121en_US


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