Finite element analysis of printed wiring board deformations during thermal cycles involved in the solder masking process

dc.contributor.author	Martin, Timothy Lee	en_US
dc.date.accessioned	2007-07-27T11:33:50Z
dc.date.available	2007-07-27T11:33:50Z
dc.date.issued	1992-05	en_US
dc.identifier.uri	http://hdl.handle.net/1853/15872
dc.publisher	Georgia Institute of Technology	en_US
dc.rights	Access restricted to authorized Georgia Tech users only.	en_US
dc.subject.lcsh	Solder and soldering	en_US
dc.subject.lcsh	Printed circuits	en_US
dc.subject.lcsh	Finite element method	en_US
dc.title	Finite element analysis of printed wiring board deformations during thermal cycles involved in the solder masking process	en_US
dc.type	Thesis	en_US
dc.description.degree	M.S.	en_US
dc.contributor.department	Mechanical engineering	en_US
dc.description.advisor	Charles I. Ume	en_US
dc.identifier.bibid	356121	en_US

Georgia Tech Theses and Dissertations [22401]
Theses and Dissertations
School of Mechanical Engineering Theses and Dissertations [3832]
Original work by students in the School of Mechanical Engineering