Highly Integrated Three Dimensional Millimeter-Wave Passive Front-End Architectures Using System-on-Package (SOP) Technologies for Broadband Telecommunications and Multimedia/Sensing Applications

Abstract

The objective of the proposed research is to present a compact system-on-package (SOP)-based passive front-end solution for millimeter-wave wireless communication/sensor applications, that consists of fully integrated three dimensional (3D) cavity filters/duplexers and antenna. The presented concept is applied to the design, fabrication and testing of V-band transceiver front-end modules using multilayer low temperature co-fired (LTCC) technology. The millimeter-wave front-end module is the foundation of 60 GHz (V-band) wireless systems for short-range multimedia applications, such as high-speed internet access, video streaming and content download. Its integration poses stringent challenges in terms of high performance, large number of embedded passive components, low power consumption, low interference between integrated components and compactness. To overcome these major challenges, a high level of integration of embedded passive functions using low-cost and high-performance materials that can be laminated in 3D, such as the multilayer LTCC, is significantly critical in the module-level design. In this work, various compact and high-performance passive building blocks have been developed in both microstrip and cavity configurations and their integration, enabling a complete passives integration solution for 3D low-cost wireless millimeter-wave front-end modules. It is worthy to note that most of the designs implemented comes away with novel ideas and is presented as the first extensive state-of-art components, entirely validated by measured data at 60 GHz bands.