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dc.contributor.authorMilner, David Williamen_US
dc.date.accessioned2007-08-17T11:31:03Z
dc.date.available2007-08-17T11:31:03Z
dc.date.issued2001-05en_US
dc.identifier.urihttp://hdl.handle.net/1853/16359
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshElectronic apparatus and appliances Packagingen_US
dc.subject.lcshIntegrated circuitsen_US
dc.titleHigh throughput flip chip assembly process application and assessment using no-flow underfill materialsen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorDaniel F. Baldwinen_US
dc.identifier.bibid607935en_US


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