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dc.contributor.authorKrempel, Louis A.en_US
dc.date.accessioned2007-08-24T11:32:19Z
dc.date.available2007-08-24T11:32:19Z
dc.date.issued1988-12en_US
dc.identifier.urihttp://hdl.handle.net/1853/16390
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshHeat Transmissionen_US
dc.subject.lcshComputer input-output equipmenten_US
dc.subject.lcshMicroelectronicsen_US
dc.titleExperimental temperature measurements of microelectronic computer boards using an infrared cameraen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorWilliam Z. Blacken_US
dc.identifier.bibid323502en_US


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