Fundamentals of solder interconnect wetting
| dc.contributor.author | Kang, Suk Chae | en_US |
| dc.date.accessioned | 2007-08-24T11:32:20Z | |
| dc.date.available | 2007-08-24T11:32:20Z | |
| dc.date.issued | 2003-05 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/16391 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
| dc.subject.lcsh | Electronic packaging Design and construction | en_US |
| dc.subject.lcsh | Solder and soldering | en_US |
| dc.subject.lcsh | Wettings | en_US |
| dc.title | Fundamentals of solder interconnect wetting | en_US |
| dc.type | Dissertation | en_US |
| dc.description.degree | Ph.D. | en_US |
| dc.contributor.department | Mechanical engineering | en_US |
| dc.description.advisor | Daniel F. Baldwin | |
| dc.identifier.bibid | 670052 | en_US |
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Georgia Tech Theses and Dissertations [22398]
Theses and Dissertations -
School of Mechanical Engineering Theses and Dissertations [3831]
Original work by students in the School of Mechanical Engineering