Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum

View/Open

nagpal_vijay_197012_ms_256513.pdf (1.635Mb)

Date

1970-12

Author

Nagpal, Vijay

Metadata

Show full item record

URI

http://hdl.handle.net/1853/16450

Collections

Georgia Tech Theses and Dissertations [22682]
School of Mechanical Engineering Theses and Dissertations [3832]