Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum

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nagpal_vijay_197012_ms_256513.pdf (1.635Mb)

Date

1970-12

Author

Nagpal, Vijay

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URI

http://hdl.handle.net/1853/16450

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Georgia Tech Theses and Dissertations [22398]
School of Mechanical Engineering Theses and Dissertations [3831]