Show simple item record

dc.contributor.authorNagpal, Vijayen_US
dc.date.accessioned2007-08-24T11:33:43Z
dc.date.available2007-08-24T11:33:43Z
dc.date.issued1970-12en_US
dc.identifier.urihttp://hdl.handle.net/1853/16450
dc.publisherGeorgia Institute of Technologyen_US
dc.subject.lcshSealing (Technology)en_US
dc.subject.lcshDiffusion bonding (Metals)en_US
dc.titleEffect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuumen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorJ. M. Bradford
dc.identifier.bibid256513en_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record