Simultaneous solder reflow and underfill cure in next generation flip chip assembly

View/Open

fennell_brett_j_200008_ms_562125.pdf (23.52Mb)

Date

2000-08

Author

Fennell, Brett Jamerson

Metadata

Show full item record

URI

http://hdl.handle.net/1853/16681

Collections

Georgia Tech Theses and Dissertations [21023]
School of Mechanical Engineering Theses and Dissertations [3618]