Simultaneous solder reflow and underfill cure in next generation flip chip assembly

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fennell_brett_j_200008_ms_562125.pdf (23.52Mb)

Date

2000-08

Author

Fennell, Brett Jamerson

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URI

http://hdl.handle.net/1853/16681

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Georgia Tech Theses and Dissertations [19949]
School of Mechanical Engineering Theses and Dissertations [3442]