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dc.contributor.authorHanna, Carlton Eisseyen_US
dc.date.accessioned2007-10-04T11:31:05Z
dc.date.available2007-10-04T11:31:05Z
dc.date.issued1999-08en_US
dc.identifier.urihttp://hdl.handle.net/1853/16841
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshIntegrated circuits Design and constructionen_US
dc.subject.lcshElectronic packagingen_US
dc.subject.lcshMicroelectronic packagingen_US
dc.subject.lcshMultichip modules (Microelectronics)en_US
dc.titleStudy of thermo-mechanical reliability of area-array packagesen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorSuresh K. Sitaramanen_US
dc.identifier.bibid496364en_US


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