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dc.contributor.authorGarratt, Jeffery Daviden_US
dc.date.accessioned2007-11-01T13:18:01Z
dc.date.available2007-11-01T13:18:01Z
dc.date.issued1993-12en_US
dc.identifier.urihttp://hdl.handle.net/1853/17052
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshPrinted circuits Design and constructionen_US
dc.subject.lcshSurface mount technologyen_US
dc.titlePrediction of thermally induced printed wiring board warpageen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorCharles I. Umeen_US
dc.identifier.bibid373410en_US


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