Show simple item record

dc.contributor.authorTsai, Wen-Kai Mikeen_US
dc.date.accessioned2007-11-01T13:18:22Z
dc.date.available2007-11-01T13:18:22Z
dc.date.issued2000-08en_US
dc.identifier.urihttp://hdl.handle.net/1853/17063
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshSurface mount technologyen_US
dc.subject.lcshMicroelectronics Testingen_US
dc.subject.lcshPackagingen_US
dc.titleHigh yield flip chip processing and failure mode analysis for surface mount applicationsen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorDaniel F. Baldwinen_US
dc.identifier.bibid563023en_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record