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dc.contributor.authorWoodmansee, Michael W.en_US
dc.date.accessioned2007-11-08T12:33:26Z
dc.date.available2007-11-08T12:33:26Z
dc.date.issued2003-08en_US
dc.identifier.urihttp://hdl.handle.net/1853/17259
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshElectronic packaging Design and constructionen_US
dc.subject.lcshSolder and solderingen_US
dc.titleObservation and modeling of heterogeneous microstructural evolution in Sn-Pb solderen_US
dc.typeDissertationen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorRichard W. Neuen_US
dc.identifier.bibid674899en_US


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