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dc.contributor.authorNeysmith, Jordan M.en_US
dc.date.accessioned2007-11-15T12:45:22Z
dc.date.available2007-11-15T12:45:22Z
dc.date.issued2000-12en_US
dc.identifier.urihttp://hdl.handle.net/1853/17559
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshMicroelectromechanical systems Design and constructionen_US
dc.subject.lcshMicroelectronic packagingen_US
dc.titleA modular, direct chip attach, wafer level MEMS package : architecture and processingen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorDaniel F. Baldwinen_US
dc.identifier.bibid589481en_US


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