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dc.contributor.authorSuman, Shivesh K.en_US
dc.date.accessioned2007-11-15T12:45:24Z
dc.date.available2007-11-15T12:45:24Z
dc.date.issued2002-08en_US
dc.identifier.urihttp://hdl.handle.net/1853/17560
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshWire bonding (Electronic packaging) Thermomechanical propertiesen_US
dc.titleCharacterization of temperature variation during the wire bonding processen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorYogendra K. Joshien_US
dc.identifier.bibid662843en_US


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