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dc.contributor.authorEbbutt, Ralphen_US
dc.date.accessioned2007-11-29T12:37:44Z
dc.date.available2007-11-29T12:37:44Z
dc.date.issued1996-08en_US
dc.identifier.urihttp://hdl.handle.net/1853/17878
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshSiliconen_US
dc.subject.lcshIntegrated circuits Wafer-scale integrationen_US
dc.titleGeneration of dicing damage in silicon wafersen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorSteven Danyuken_US
dc.identifier.bibid429415en_US


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