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dc.contributor.authorPyland, Jamesen_US
dc.date.accessioned2007-12-20T12:30:52Z
dc.date.available2007-12-20T12:30:52Z
dc.date.issued2002-05en_US
dc.identifier.urihttp://hdl.handle.net/1853/18851
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshElectronic packaging Reliabilityen_US
dc.subject.lcshSolder and soldering Reliabilityen_US
dc.subject.lcshSolder and soldering Thermal fatigueen_US
dc.subject.lcshElectronic packaging Thermal fatigueen_US
dc.titleDamage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditionsen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorSuresh K. Sitaramanen_US
dc.identifier.bibid629523en_US


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