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dc.contributor.authorRay, Atris A., IIIen_US
dc.date.accessioned2008-01-17T14:14:01Z
dc.date.available2008-01-17T14:14:01Z
dc.date.issued1998-12en_US
dc.identifier.urihttp://hdl.handle.net/1853/19147
dc.publisherGeorgia Institute of Technologyen_US
dc.rightsAccess restricted to authorized Georgia Tech users only.en_US
dc.subject.lcshMicroelectronic packagingen_US
dc.subject.lcshHeat Transmissionen_US
dc.subject.lcshElectronic apparatus and appliances Coolingen_US
dc.subject.lcshMaterials Thermal propertiesen_US
dc.titleAnalytical and experimental analysis of heat transfer from current microelectronics package designsen_US
dc.typeDissertationen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMechanical engineeringen_US
dc.description.advisorWilliam Z. Blacken_US
dc.identifier.bibid485321en_US


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