Study on metal adhesion mechanisms in high density interconnect printed circuit boards

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Please use this identifier to cite or link to this item: http://hdl.handle.net/1853/19628

Title: Study on metal adhesion mechanisms in high density interconnect printed circuit boards
Author: Martin, Lara J.
Type: Thesis
URI: http://hdl.handle.net/1853/19628
Date: 2000-05
Publisher: Georgia Institute of Technology
Subject: Microelectronic packaging Materials
Adhesion
Metals Testing
Printed circuits Materials
Department: Materials science and engineering
Advisor: C. P. Wong
Degree: M.S.

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