High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures

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Please use this identifier to cite or link to this item: http://hdl.handle.net/1853/25011

Title: High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures
Alternative Title: Integrated Circuits:The Problem with Wires (and Some Solutions)
Author: Kohl, Paul A. ; Spencer, Todd ; Osborn, Tyler
Abstract: The "off-chip" bandwidth is a major bottleneck causing system delays and limited throughput, especially in areas such as processor-to-memory bandwidth and processor-to-network. The ITRS cites off-chip signal bandwidth exceeding 60 GHz within 10 years. Organic substrates (i.e. chip packages or interposers) with flip-chip solder connections are the core of the first and second level of interconnect. Off-chip bandwidth is limited to several GHz due to frequency dependent attenuation, signal reflections, and crosstalk within the polymer dielectric, via structures, and I/O signal path transitions within the chip substrate and mother board. In this work, we have introduced advances in off-chip interconnect using air-isolated, coaxial links on substrates and boards to demonstrate ultra high-speed chip-to-chip and chip-to-network communications. New approaches have been found to fabricating high frequency I/O, air-and isolated coaxial links on the substrate. The materials, processes and electrical characteristics will be presented.
Description: Paul A. Kohl, Todd Spencer and Tyler Osborn from the School of Chemical and Biomolecular Engineering presented a lecture at the Nano@Tech Meeting on September 9, 2008 at 12 noon in room 102 of the MiRC building. Runtime: 61:09 minutes
Type: Lecture
Video
URI: http://hdl.handle.net/1853/25011
Date: 2008-09-09
Contributor: Georgia Institute of Technology. School of Chemical and Biomolecular Engineering
Publisher: Georgia Institute of Technology
Subject: Nanotechnology
Interconnect
Microelectronics
Off-chip bandwidth

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